FYS9260 – Microsystems and Electronic Packaging and Interconnection Technologies
Schedule, syllabus and examination date
Design, production and properties of different components used in electronic products. Component encapsulating. Circuit boards and other component carriers. Production processes for electronics. Soldering, bonding and gluing. Hole mounting and surface mounting. Thick/thin film hybrid technique, polymer thick film technology, "Chip-on-board", TAB, automation, flexible robots. Reliability.
After completing the course:
- you have knowledge of important factors that affect the reliability of electronics and sensor systems, and can use this knowledge to design solutions suitable for a given application
- you are familiar with the work process (from user requirements, via specification, design of the production basis, PCB production and assembly of components, to test and verification of finished cards) when designing electronics
- you are familiar with how common circuit board technologies and electronics components are built
- you can make simple predictions about, among other things, thermomechanical stress, heat fluxes / cooling requirements and failure rates of fault mechanisms
- you are familiar with central processes for creating MEMS sensor and actuator elements in silicon, and know the challenges of packing such elements into components that can be used together but other electronics.
Admission to the course
PhD candidates from the University of Oslo should apply for classes and register for examinations through Studentweb.
If a course has limited intake capacity, priority will be given to PhD candidates who follow an individual education plan where this particular course is included. Some national researchers’ schools may have specific rules for ranking applicants for courses with limited intake capacity.
PhD candidates who have been admitted to another higher education institution must apply for a position as a visiting student within a given deadline.
Recommended previous knowledge
- 10 credits overlap with FYS4260 – Microsystems and Electronic Packaging and Interconnection Technologies.
The first lecture is mandatory. If you are unable to attend, the Department of Physics has to be informed no later than the same day (email@example.com), or else you will lose your place in the course.
The course extends over a full semester with 30 hours hours of lectures (2 hours per week) and about 60 hours mandatory projectwork. A mandatory report from the project work which counts for 20% of the final grade has to be handed in. There will be a joint summary where all the students present their results and learningoutcomes. In addition voluntary exercises with soultions will be offered.
The students will immerse themselves in a chosen or proposed topic relevant to the course followed by a mandatory presentation.
Regulations for mandatory assignments can be found here.
The project assignment is weighted 20% of the final grade. To qualify for the final examination, the project assignment must be passed.
Final written or oral exam (3 hours) with 80% weight. The form of the final exam will be decided based on the number of students admitted to the course after 1 February.
To pass the course you have to pass the project assignment and the final exam.
It will also be counted as one of the three attempts to sit the exam for this course, if you sit the exam for one of the following courses: FYS4260 – Microsystems and Electronic Packaging and Interconnection Technologies
Examination support material
Necessary fomulas and data will be given on the exam.
Language of examination
Subjects taught in English will only offer the exam paper in English. You may write your examination paper in Norwegian, Swedish, Danish or English.
Grades are awarded on a pass/fail scale. Read more about the grading system.
Resit an examination
This course offers both postponed and resit of examination. Read more: