FYS3260 – Microsystems and electronic packaging and interconnection technologies
Schedule, syllabus and examination date
Design, production and properties of different components used in electronic products. Component encapsulating. Circuit boards and other component carriers. Production processes for electronics. Soldering, bonding and gluing. Hole mounting and surface mounting. Thick/thin film hybrid technique, polymer thick film technology, "Chip-on-board", TAB, automation, flexible robots. Reliability.
The student will gain insight into the different technologies in electronic components and modern electronic production. Practical experience through lab work.
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Formal prerequisite knowledge
In addition to fulfilling the minimum requirements for entrance to higher education in Norway, you must either have 2MX/2MY/3MZ and 3MX/3FY/3KJ/3BI/(2KJ+3BT)/(2BI+3BT) from Norwegian upper secondary school, or have completed equivalent studies in mathematics as well as physics, or chemistry, or biology at upper secondary school or university level at another educational institution. Read more about fulfilling special requirements.
Recommended previous knowledge
10 credits overlap against FYS317.
The course extends over a full semester with 2 hours of lectures per week and a total of 20 hours of project and lab work. There will also be a few excursions.
Final written exam. Letter grade.