FYS4260 – Microsystems and Electronic Packaging and Interconnection Technologies
Schedule, syllabus and examination date
Design, production and properties of different components used in electronic products. Component encapsulating. Circuit boards and other component carriers. Production processes for electronics. Soldering, bonding and gluing. Hole mounting and surface mounting. Thick/thin film hybrid technique, polymer thick film technology, "Chip-on-board", TAB, automation, flexible robots. Reliability.
Learning goals: The student should learn to:
- Have basic knowledge of different production methods for electronics and microsystems.
- Have knowledge of the most used materials and understand the importance of their properties.
- Understand the driving trends.
- Knowledge about important failure mechanisms in Electronics.
- Have basic knowledge of the function and construction of clean rooms.
- Failure mechanisms in electronics
- Development trends for electronic packaging.
- Basic manufacturing processes for electronics
- Printed wiring boards and printed circuit boards
- Thermal management
- High speed operation
- Hybrid circuits and multichip modules
- Microsystems technology
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Recommended previous knowledge
10 credits overlap against FYS9260 – Microsystems and Electronic Packaging and Interconnection Technologies.
The course extends over a full semester with 2 hours of lectures per week and a total of 20 hours of project and lab work. There will also be a few excursions. There will be one compulsory laboratory project work.
Regulations for mandatory assignments can be found here.
As the teaching involves laboratory and/or field work, you should consider taking out a separate travel and personal risk insurance. Read about your insurance cover as a student.
1 compulsory laboratory project work with 20% weight. Final written exam (3 hours) with 80% weight.
Grades are awarded on a scale from A to F, where A is the best grade and F is a fail. Read more about the grading system.
Explanations and appeals
Resit an examination
This course offers both postponed and resit of examination. Read more:
Special examination arrangements
Application form, deadline and requirements for special examination arrangements.
The course is subject to continuous evaluation. At regular intervals we also ask students to participate in a more comprehensive evaluation.