FYS9260 – Microsystems and Electronic Packaging and Interconnection Technologies
Course description
Course content
The course gives an introduction to how modern electronics and sensor components are constructed and assembled. The course does not deal with the design of electronic circuits, but rather builds understanding about how aspects like material technology and mechanical, thermal, and electrical properties affect the electronic system functionality and reliability. The course deals primarily with conventional electronics, but also describes opportunities and challenges associated with the construction and packaging of micro-electro-mechanical systems (MEMS)
Learning outcome
After completing the course:
- you have knowledge of important factors that affect the reliability of electronics and sensor systems and can use this knowledge to design solutions suitable for a given application.
- you are familiar with the work process (from user requirements, via specification, design of the production basis, PCB production, and assembly of components, to test and verification of finished cards) when designing electronics.
- you are familiar with how common circuit board technologies and electronics components are built.
- you can make simple predictions about, among other things, thermomechanical stress, heat fluxes/cooling requirements, and failure rates of fault mechanisms.
- you are familiar with central processes for creating MEMS sensor and actuator elements in silicon and know the challenges of packing such elements into components that can be used together but other electronics.
Admission to the course
PhD candidates from the University of Oslo should apply for classes and register for examinations through Studentweb.
If a course has limited intake capacity, priority will be given to PhD candidates who follow an individual education plan where this particular course is included. Some national researchers’ schools may have specific rules for ranking applicants for courses with limited intake capacity.
PhD candidates who have been admitted to another higher education institution must apply for a position as a visiting student within a given deadline.
Recommended previous knowledge
Overlapping courses
- 10 credits overlap with FYS4260 – Microsystems and Electronic Packaging.
- 10 credits overlap with FYS3260 – Microsystems and electronic packaging.
Teaching
The first lecture is mandatory. If you are unable to attend, the Department of Physics has to be informed no later than the same day (studieinfo@fys.uio.no), or else you will lose your place in the course.
The course extends over a full semester:
- 30 hours of lectures (2 hours per week)
- about 60 hours of mandatory project work per semester.
You need to hand in a report from the project work. There will also e a joint summary where all the students present their results and learning outcomes. In addition, voluntary exercises with solutions will be offered.
As the teaching involves laboratory and/or fieldwork, you should consider taking out separate travel and personal risk insurance. Read about your insurance cover as a student.
Examination
- Midterm home exam in the form of a project assignment which counts 20 % towards the final grade.
- Final oral exam which counts 80 % towards the final grade.
Both the project assignment and the final exam must be passed to get a final grade in this course.
When writing your exercises make sure to familiarize yourself with the rules for use of sources and citations. Breach of these rules may lead to suspicion of attempted cheating.
It will also be counted as one of the three attempts to sit the exam for this course, if you sit the exam for one of the following courses: FYS4260 – Microsystems and Electronic Packaging
Examination support material
Necessary fomulas and data will be given on the exam.
Language of examination
Subjects taught in English will only offer the exam paper in English. You may write your examination paper in Norwegian, Swedish, Danish or English.
Grading scale
Grades are awarded on a pass/fail scale. Read more about the grading system.
Resit an examination
This course offers both postponed and resit of examination. Read more:
More about examinations at UiO
- Use of sources and citations
- Special exam arrangements due to individual needs
- Withdrawal from an exam
- Illness at exams / postponed exams
- Explanation of grades and appeals
- Resitting an exam
- Cheating/attempted cheating
You will find further guides and resources at the web page on examinations at UiO.